 With their Core Technology: Plated Copper on Thick films (PCTF ®), REMTEC (USA) utilizes a patented manufacturing process to produce layers of plated copper (up to .010" thick), allowing high current capacity in excess of 50 Amps as well as excellent heat spreading and low thermal resistance. Solid metal via capability ensures significant improvement in thermal management and electrical performance
Remtec provides custom and semi-custom packaging solutions with PCTF® metallization on Alumina, BeO, AlN, Barium Titanate and Quartz for DC power electronics, optoelectronics and MW/RF components and modules.
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