מערכות ניקוי ושטיפת לוחות PC וסטנסילים בתעשיית האלקטרוניקה.
HOTPACK CLEANING SYSTEMS REPRESENT THE LATEST TECHNOLOGY FOR BATCH
OR A , STENCILS ,.CLEANING APPLICATIONS. CAN BE USED TO CLEAN PB BOARDS
COMBINATION OF BOTH AND ARE COMPATIBLE WITH A VARIETY OF CHEMISTRIES TO
RMA AND OA FLUX RESIDUES FROM , WATER-SOLUBLE LOW SOLID ,REMOVE ADHESIVES
. THEY CAN ALSO REMOVE SOLDER PASTE FROM STENCILS ;PC BOARDS
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